Process Development for Intrusive Reflow

Component technologies have changed vastly during the rapid development of the telecom's sector, forcing physical size down and down to 0201 passives and µBGA or CSP chip packages. However, under certain product requirements, the ability for all components to be miniature surface mount devices can be stopped in its tracks when it comes to items like connectors. Inherently some of the reasoning for this is related to ability in providing adequate mechanical strength when surface mounted, but whatever the reason, the result can be a 97% surface mount board which then has to have a few connections separately soldered.

The example (right) was one connector of 4 on a PCB. The problem was not only the fact that soldering these was a manual operation, but this operation was adding disproportionate minutes to assembly time. The earth pins, although reasonably well thermally isolated, required a lot of heat, and to achieve a good joint, skilled operators were required.

This is a classic scenario for the use of 'intrusive reflow'. Plextek consultants carried out discussions with suppliers on this and other components, and after some process trials, a successful outcome was achieved, eliminating assembly time and increasing product throughput.

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